High performance, accurate, flexible, reliable equipments for precision electronic industry
Die Bonders Fond texte Die Bonder

High quality
optical device

Die Bonder

Eutectic

Die Bonder

Epoxy

JFP DIE BONDERS

Our die bonders achieve high accuracy placement, using adjustable magnification optical device.

Functionnalities : stamping, eutectic and epoxy.

User friendly, flexible, our Die Bonders require only minimum training to operate.

placer PP1-Placer Fond texte

MANUAL PLACER

PP-ONE Manual placer

The Manual Sorter PP-One model is designed for accurate Picking and Placement of delicate devices as Laser Diodes and Laser Bars.

The machine will pick the components from wafer hoops to place them into GelPack or Waffle Packs.

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die bonder PP6 Die Bonder Fond texte

UNIVERSAL DIE BONDER

PP6 series

It's the most versatile semi automatic Pick & Place platform. It can be used in a wide field of applications such as ASIC, MMIC, MEMS or VECEL.

PP5 and PP6 are user friendly, flexible and requires minimal training to operate.

Eutectic and Epoxy available.

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Rework Station PP7 Rework Station Fond texte

REWORK STATION

PP-7 Flexible Rework station

The PP-7 Rework Station is a complete solution semi automatic Flip-Chip and flexible rework plateform.

It is able to:
Pick & Place, Sort chips from a wafer, Dispense Epoxy, Stamp glue, Reflow solder paste, and Achieve Eutectic Bonds.

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