JFP DIE BONDERS
Our die bonders achieve high accuracy placement, using adjustable magnification optical device.
Functionnalities : stamping, eutectic and epoxy.
User friendly, flexible, our Die Bonders require only minimum training to operate.
PP-ONE Manual placer
The Manual Sorter PP-One model is
designed for accurate Picking and
Placement of delicate devices as Laser
Diodes and Laser Bars.
The machine will pick the components from wafer hoops to place them into GelPack or Waffle Packs.
UNIVERSAL DIE BONDER
It's the most versatile semi automatic Pick & Place platform. It can be used in a
wide field of applications such as ASIC, MMIC, MEMS or VECEL.
PP5 and PP6 are user friendly, flexible and requires minimal training to operate.
Eutectic and Epoxy available.